2024年11月18-21日，第十屆國際第三代半導體論壇（IFWS2024）&第二十一屆中國國際半導體照明論壇（SSLCHINA2024）、先進半導體技術應用創新展（CASTAS）將在蘇州國際博覽中心舉辦。
元旭半導體科技股份有限公司（簡稱"元旭半導體"）將攜多款Micro-LED芯片、COB顯示產品亮相此次展會。值此，誠摯邀請第三代半導體產業同仁共聚論壇，蒞臨A04號展位參觀交流、洽談合作。
同時，元旭半導體科技股份有限公司董事會主席兼首席執行官（CEO）席光義將出席論壇，并將在“Mini/Micro-LED技術產業應用峰會”上，分享《從芯到屏，垂直整合 開啟Micro-LED智慧顯示時代》的主題報告。敬請關注！
報告嘉賓
席光義
元旭半導體科技股份有限公司董事會主席兼首席執行官（CEO）
席光義博士（清華大學電子工程系），是我國最早從事GaN基LED、HEMT材料與器件的科研人員之一，師從中國工程院院士、半導體光電子技術專家羅毅院士。作為元旭半導體科技股份有限公司董事會主席兼首席執行官（CEO），席光義博士帶領科研隊伍始終聚焦于Micro LED顯示芯片產業布局，并建立了具有自主知識產權的“IDM 2.0”創新模式技術體系，解決了我國大尺寸高光效圖形化藍寶石襯底嚴重依賴進口的問題。自2003年起，席光義博士開始從事半導體產業的研發工作，曾參與國家重大科技專項，并發表了十余篇論文。2014年，他與團隊共同創立了元旭半導體科技股份有限公司，成功實現了Micro LED顯示芯片、新型視覺技術等關鍵技術的布局，并積極推動Micro LED新一代半導體顯示技術的產業升級。
演講報告：《從芯到屏，垂直整合 開啟Micro-LED智慧顯示時代》
演講會場：Mini/Micro-LED技術產業應用峰會
關于元旭半導體Company Profile
元旭半導體科技股份有限公司創立于2014年，致力于Micro-LED芯片技術和新一代智慧顯示產品的研發與產業化創新。 作為Micro-LED顯示行業的技術型領軍企業，元旭半導體以自研Micro-LED顯示芯片和先進集成封裝技術作為強支撐，聚焦于新一代智慧顯示產品的設計與創新，形成從Micro-LED顯示芯片、先進集成封裝到新一代智慧顯示產品的垂直整合智造，創新性地打造了“IDM 2.0”創新模式體系，涵蓋設計、研發、生產、銷售于一體，實現“從芯到屏”的一站式產業化布局，在成本控制和產品性能特征方面實現跨越式地提升。
INNOSHINE Technology Co., Ltd.（“INNOSHINE”）was established in 2014 and is dedicated to the research and industrialization of Micro-LED chip technology and next-generation smart display products.
As a technology-driven pioneer in the Micro-LED display industry, Yuanxu Semiconductor relies on its self-developed Micro-LED display chip and advanced integrated packaging technology as strong support, focusing on the design and innovation of next-generation smart display products. It has formed a vertically integrated smart manufacturing system from Micro-LED display chips, advanced integrated packaging to next-generation smart display products, and has innovatively created a "IDM 2.0" innovation model system, covering design, R&D, production, and sales, to achieve a one-stop industrial layout from "core to screen" and achieve a breakthrough in cost control and product performance characteristics. For further information on INNOSHINE, please visit our website at: www.novoshine.com.
產品介紹/about Products
（一）晶圓襯底 Wafer substrate
（1）藍寶石基材料晶圓襯底——元旭半導體在藍寶石襯底材料方面實現多個全國首創。2014年，首創完成濕法晶圓襯底，帶領公司率先實現國產化；2018年，元旭半導體首創完成六英寸納米晶圓襯底，并實現大規模量產，著力破解半導體領域“卡脖子”難題。
（2）硅基材料晶圓襯底——作為實現Micro-LED集成應用的關鍵材料技術，元旭半導體開發出8英寸、12英寸硅基GaN外延，為實現晶圓級集成電路打下堅實基礎。
(1) Sapphire substrate material wafers - INNOSHINE has achieved several national firsts in sapphire substrate material. In 2014, it pioneered the wet process wafer substrate, leading the company to become the first to achieve domestication. In 2018, INNOSHINE pioneered the production of 6-inch nanocrystalline wafer substrate and achieved mass production, focusing on breaking the "neck-tie" problem in the semiconductor field.
(2) Silicon-based material wafer substrate - As a key material technology for realizing Micro-LED integrated applications, INNOSHINE has developed 8-inch and 12-inch silicon-based GaN epitaxy, laying a solid foundation for wafer-level integrated circuits.
（二）Micro-LED芯片 Micro-LED chip
元旭半導體自研全新Micro-LED芯片，重新定義Micro-LED芯片結構及IDM 2.0集成工藝架構，將LED行業分離器件跨入到Micro-LED集成芯片時代。在Micro-LED技術的研發上，不僅突破了芯片設計、微型化薄膜芯片、巨量轉移、超高精度布線等關鍵技術，更實現了超高清像素直顯、低功耗超節能、高亮度、寬色域、高對比度、寬視角、高動態特性、高可靠性等優異顯示性能，并通過優化芯片排布方式、無引線電連接、封裝結構和表面處理工藝，進一步提高產品可靠性，為Micro-LED新型顯示技術的革新提供強有力支撐。
INNOSHINE has developed a brand new Micro-LED chip, redefining the Micro-LED chip structure and IDM 2.0 integrated process architecture, bringing the LED industry from a separable device era to the Micro-LED integrated chip era. In the research and development of Micro-LED technology, not only has INNOSHINE broken through key technologies such as chip design, miniaturization of thin film chips, mass transfer, ultra-high precision wiring, but it has also achieved excellent display performance such as ultra-high resolution pixel direct display, low power consumption and ultra-energy saving, high brightness, wide color gamut, high contrast ratio, wide viewing angle, and high dynamic characteristics, as well as high reliability. Furthermore, by optimizing the chip layout, wirelessly connecting the chips, and improving the packaging structure and surface treatment process, INNOSHINE has further enhanced the reliability of its products, providing strong support for the innovation of Micro-LED new display technology.
（三）全倒裝COB LED顯示屏 Full-flip COB LED Display
在“自主性研發＋智能化制造自主化生產”雙重核心能力的驅動下，元旭半導體依托天津、無錫集成光電子整合智造工廠，原廠生產并成體系推出“Xmeta”、“光璨”、“LEG GO”三大系列產品，產品分別定位于專業顯示、商業顯示與場景化解決方案顯示，真正實現從芯片設計到封測的高度自主可控。
元旭半導體COB顯示產品全面搭載級半導體級生產工藝，并在超精密生產環境（百級潔凈空間）中進行制造，顯著降低生產過程中異物對Micro-LED產品良品率和質量穩定性的影響。COB顯示產品特有的高亮度、高對比度、高分辨力、低電壓驅動、低功耗、低屏溫、長壽命等突出特點，為指揮控制中心、大數據中心、智慧城市、數字孿生、工業仿真、文旅文化產業等對畫質有較高要求的應用環境而進行高端化定制。元旭半導體積極推動Micro-LED技術發展，使其逐步拓展ToB及ToC市場。
Driven by the dual core capabilities of independent R&D and intelligent manufacturing and production, INNOSHINE has relied on its integrated optoelectronics integration and manufacturing factories in Tianjin and Wuxi to produce and systematically launch the "Xmeta", "G", and "LEG GO" product series. The products are respectively positioned in professional display, commercial display, and scene-based solution display, and truly achieve full control over the chip design and packaging and testing from a height of autonomy.
INNOSHINE's COB display products are fully equipped with semiconductor-level production processes and manufactured in ultra-precise production environments (class 100 clean space), significantly reducing the impact of foreign objects on the Micro-LED product yield and stability. The COB display products have distinctive features such as high brightness, high contrast ratio, high resolution, low voltage driving, low power consumption, low screen temperature, and long life, which are specially tailored for high-end customization for application environments with high requirements for image quality, such as command and control centers, big data centers, smart cities, digital twins, industrial simulation, and cultural and tourism industries. INNOSHINE actively promotes the development of Micro-LED technology to gradually expand its market to both B and C segments.
參會聯系：
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