Condura.ultraTM無銀AMB氮化硅基板---車規級功率模塊用高性價比解決方案Condura.ultraTM silver free AMB --- cost-effective solution for automotive power module張靖賀利氏電子中國區研發總監ZHANG JingDirector of Innovation China, Heraeus Electronics
用于先進SiC功率模塊的整體解決（核心設備/材料/工程）方案Overall solution (core equipment/materials/engineering) for advanced SiC power module周鑫蘇州博湃半導體技術有限公司市場銷售總監ZHOU XinDirector of Sales Marketing, Suzhou Bopai Semiconductor Technology Co., Ltd.
多熱阻陣列LED模塊的結溫監視 Junction Temperature Monitoring of the Multi-LED Module in Service with the Thermal Resistance Matrix李世瑋 香港科技大學先進微系統封裝中心主任、香港科技大學深圳研究院常務副院長 Shi-Wei.Ricky LEEProfessor and Director of Center for Advanced Microsystems Packaging (CAMP) of Hong Kong University of Science and Technology.
